M38510/10107BPA
vs
M38510/10107SPX
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
ANALOG DEVICES INC
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP, DIP8,.3
|
DIP,
|
| Pin Count |
8
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
|
| Average Bias Current-Max (IIB) |
0.4 µA
|
0.4 µA
|
| Bias Current-Max (IIB) @25C |
0.25 µA
|
|
| Frequency Compensation |
YES
|
|
| Input Offset Voltage-Max |
6000 µV
|
6000 µV
|
| JESD-30 Code |
R-CDIP-T8
|
R-CDIP-T8
|
| JESD-609 Code |
e0
|
e0
|
| Low-Offset |
NO
|
|
| Neg Supply Voltage Limit-Max |
-22 V
|
-22 V
|
| Neg Supply Voltage-Nom (Vsup) |
-10 V
|
-15 V
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP8,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-PRF-38535 Class B
|
|
| Slew Rate-Min |
40 V/us
|
40 V/us
|
| Supply Current-Max |
9 mA
|
8 mA
|
| Supply Voltage Limit-Max |
22 V
|
22 V
|
| Supply Voltage-Nom (Vsup) |
10 V
|
15 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
BIPOLAR
|
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Voltage Gain-Min |
10000
|
50000
|
| Base Number Matches |
2
|
1
|
| Common-mode Reject Ratio-Min |
|
80 dB
|
| Micropower |
|
NO
|
|
|
|
Compare M38510/10107BPA with alternatives
Compare M38510/10107SPX with alternatives