M38510/19007BEC
vs
DG508ABK
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
SILICONIX INC
|
HARRIS SEMICONDUCTOR
|
| Package Description |
DIP-16
|
DIP-16
|
| Reach Compliance Code |
unknown
|
unknown
|
| Analog IC - Other Type |
SINGLE-ENDED MULTIPLEXER
|
SINGLE-ENDED MULTIPLEXER
|
| JESD-30 Code |
R-CDIP-T16
|
R-GDIP-T16
|
| Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
| Number of Channels |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-25 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-M-38510 Class B
|
|
| Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
| Surface Mount |
NO
|
NO
|
| Switch-off Time-Max |
1500 ns
|
|
| Switch-on Time-Max |
1500 ns
|
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
OTHER
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
2
|
8
|
| Rohs Code |
|
No
|
| HTS Code |
|
8542.39.00.01
|
| JESD-609 Code |
|
e0
|
| Off-state Isolation-Nom |
|
68 dB
|
| On-state Resistance Match-Nom |
|
16.2 Ω
|
| On-state Resistance-Max (Ron) |
|
450 Ω
|
| Package Equivalence Code |
|
DIP16,.3
|
| Signal Current-Max |
|
0.02 A
|
| Supply Current-Max (Isup) |
|
2.4 mA
|
| Switching |
|
BREAK-BEFORE-MAKE
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
| Terminal Pitch |
|
2.54 mm
|
|
|
|
Compare M38510/19007BEC with alternatives