M38510/23112BWX vs M38510/23112BWA feature comparison

M38510/23112BWX STMicroelectronics

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M38510/23112BWA Texas Instruments

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP
Package Description DIP, DIP,
Pin Count 22
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 75 ns 75 ns
JESD-30 Code R-XDIP-T22 R-XDIP-T22
Memory Density 1024 bit 1024 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 4 4
Number of Functions 1 1
Number of Terminals 22 22
Number of Words 256 words 256 words
Number of Words Code 256 256
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 256X4 256X4
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 7 5
Screening Level MIL-M-38510 Class B

Compare M38510/23112BWX with alternatives

Compare M38510/23112BWA with alternatives