M38510/31902BFA
vs
M38510/31902B2A
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
LANSDALE SEMICONDUCTOR INC
|
| Part Package Code |
DFP
|
QLCC
|
| Package Description |
DFP, FL16,.3
|
QCCN, LCC20,.35SQ
|
| Pin Count |
16
|
20
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| JESD-30 Code |
R-CDFP-F16
|
S-CQCC-N20
|
| JESD-609 Code |
e0
|
e0
|
| Memory Density |
16 bit
|
16 bit
|
| Memory IC Type |
MEMORY CIRCUIT
|
MEMORY CIRCUIT
|
| Memory Width |
4
|
4
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
20
|
| Number of Words |
4 words
|
4 words
|
| Number of Words Code |
4
|
4
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
4X4
|
4X4
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DFP
|
QCCN
|
| Package Equivalence Code |
FL16,.3
|
LCC20,.35SQ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
FLATPACK
|
CHIP CARRIER
|
| Qualification Status |
Not Qualified
|
Qualified
|
| Screening Level |
MIL-PRF-38535 Class B
|
MIL-PRF-38535 Class B
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
FLAT
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare M38510/31902BFA with alternatives
Compare M38510/31902B2A with alternatives