M38510/54001BYX vs MC68000P12F feature comparison

M38510/54001BYX NXP Semiconductors

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MC68000P12F Motorola Mobility LLC

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SIGNETICS CORP MOTOROLA INC
Part Package Code DIP DIP
Package Description DIP, DIP, DIP64,.9
Pin Count 64 64
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 16 23
Bit Size 16 32
Boundary Scan YES NO
Clock Frequency-Max 6 MHz 16.67 MHz
External Data Bus Width 16 16
Format FLOATING POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code R-XDIP-T64 R-PDIP-T64
Low Power Mode YES NO
Number of Terminals 64 64
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Screening Level MIL-M-38510 Class B
Speed 6 MHz 16.67 MHz
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR
Base Number Matches 4 3
Rohs Code No
JESD-609 Code e0
Length 81.535 mm
Number of DMA Channels
Number of External Interrupts 7
Number of Serial I/Os
On Chip Data RAM Width
Package Equivalence Code DIP64,.9
RAM (words) 0
Seated Height-Max 5.84 mm
Supply Current-Max 50 mA
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 22.86 mm

Compare M38510/54001BYX with alternatives

Compare MC68000P12F with alternatives