M54HC00K1
vs
MM54HC00W
feature comparison
| Part Life Cycle Code |
Not Recommended
|
Obsolete
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
DFP
|
DFP
|
| Package Description |
DFP, FL14,.3
|
DFP, FL14,.3
|
| Pin Count |
14
|
14
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
STMicroelectronics
|
|
| Family |
HC/UH
|
HC/UH
|
| JESD-30 Code |
R-CDFP-F14
|
R-GDFP-F14
|
| JESD-609 Code |
e0
|
e0
|
| Length |
9.95 mm
|
9.614 mm
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
NAND GATE
|
NAND GATE
|
| Max I(ol) |
0.004 A
|
|
| Number of Functions |
1
|
4
|
| Number of Inputs |
2
|
2
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DFP
|
DFP
|
| Package Equivalence Code |
FL14,.3
|
FL14,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Packing Method |
TR
|
|
| Prop. Delay@Nom-Sup |
22 ns
|
|
| Propagation Delay (tpd) |
110 ns
|
27 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Schmitt Trigger |
NO
|
NO
|
| Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
4.5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Total Dose |
50k Rad(Si) V
|
|
| Width |
6.91 mm
|
6.35 mm
|
| Base Number Matches |
1
|
3
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
| Seated Height-Max |
|
2.032 mm
|
|
|
|
Compare M54HC00K1 with alternatives
Compare MM54HC00W with alternatives