M74HC4514B1R vs MC74LVQ138M feature comparison

M74HC4514B1R STMicroelectronics

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MC74LVQ138M Motorola Mobility LLC

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS MOTOROLA INC
Part Package Code DIP SOIC
Package Description PLASTIC, DIP-24 SOP, SOP16,.3
Pin Count 24 16
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature ADDRESS LATCHES 3 ENABLE INPUTS
Family HC/UH LVQ
Input Conditioning LATCHED STANDARD
JESD-30 Code R-PDIP-T24 R-PDSO-G16
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type 4-LINE TO 16-LINE DECODER 3-LINE TO 8-LINE DECODER
Max I(ol) 0.004 A 0.012 A
Number of Functions 1 1
Number of Terminals 24 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity TRUE INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP24,.6 SOP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Packing Method TUBE
Peak Reflow Temperature (Cel) 245
Prop. Delay@Nom-Sup 56 ns 15 ns
Propagation Delay (tpd) 230 ns 20 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 6 V 3.6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 3.3 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15.24 mm 5.275 mm
Base Number Matches 1 1
JESD-609 Code e0
Length 10.2 mm
Seated Height-Max 2.05 mm
Terminal Finish TIN LEAD

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Compare MC74LVQ138M with alternatives