M74VHC1GT66DTT1G
vs
FSAT66L6X
feature comparison
Pbfree Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ONSEMI
|
FAIRCHILD SEMICONDUCTOR CORP
|
Part Package Code |
TSOP-5
|
SOIC
|
Package Description |
TSOP-5
|
1 MM, MICROPAK-6
|
Pin Count |
5
|
6
|
Manufacturer Package Code |
483
|
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
2 Days
|
|
Samacsys Manufacturer |
onsemi
|
|
Analog IC - Other Type |
SPST
|
SPST
|
JESD-30 Code |
R-PDSO-G5
|
R-XDSO-N6
|
JESD-609 Code |
e3
|
e4
|
Length |
3 mm
|
1.45 mm
|
Moisture Sensitivity Level |
1
|
1
|
Normal Position |
NO
|
NO
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
5
|
6
|
Off-state Isolation-Nom |
80 dB
|
50 dB
|
On-state Resistance-Max (Ron) |
60 Ω
|
30 Ω
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
TSSOP
|
VSON
|
Package Equivalence Code |
TSOP5/6,.11,37
|
SOLCC6,.04,20
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.1 mm
|
0.55 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2 V
|
1.65 V
|
Supply Voltage-Nom (Vsup) |
3 V
|
2.3 V
|
Surface Mount |
YES
|
YES
|
Switch-off Time-Max |
50 ns
|
9 ns
|
Switch-on Time-Max |
50 ns
|
7 ns
|
Switching |
BREAK-BEFORE-MAKE
|
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
NICKEL GOLD
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
0.95 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
1.5 mm
|
1 mm
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
Yes
|
|
|
|
Compare M74VHC1GT66DTT1G with alternatives
Compare FSAT66L6X with alternatives