MAC6401B
vs
SC241B
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Contact Manufacturer
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
SEMITRONICS CORP
|
| Package Description |
,
|
PRESS FIT, O-MUPF-D2
|
| Reach Compliance Code |
unknown
|
unknown
|
| Critical Rate of Rise of Commutation Voltage-Min |
3 V/us
|
4 V/us
|
| Critical Rate of Rise of Off-State Voltage-Min |
40 V/us
|
50 V/us
|
| DC Gate Trigger Current-Max |
50 mA
|
50 mA
|
| DC Gate Trigger Voltage-Max |
2.5 V
|
2.5 V
|
| Holding Current-Max |
60 mA
|
50 mA
|
| JESD-609 Code |
e0
|
e0
|
| Leakage Current-Max |
4 mA
|
0.5 mA
|
| On-State Voltage-Max |
2.5 V
|
|
| Operating Temperature-Max |
100 °C
|
100 °C
|
| Operating Temperature-Min |
-60 °C
|
-40 °C
|
| RMS On-state Current-Max |
30 A
|
6 A
|
| Repetitive Peak Off-state Voltage |
200 V
|
200 V
|
| Surface Mount |
NO
|
NO
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Trigger Device Type |
TRIAC
|
TRIAC
|
| Base Number Matches |
4
|
3
|
| Pbfree Code |
|
No
|
| Pin Count |
|
2
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.30.00.80
|
| Configuration |
|
SINGLE
|
| JESD-30 Code |
|
O-MUPF-D2
|
| Number of Elements |
|
1
|
| Number of Terminals |
|
2
|
| Package Body Material |
|
METAL
|
| Package Shape |
|
ROUND
|
| Package Style |
|
PRESS FIT
|
| Qualification Status |
|
Not Qualified
|
| Repetitive Peak Off-state Leakage Current-Max |
|
100 µA
|
| Terminal Form |
|
SOLDER LUG
|
| Terminal Position |
|
UPPER
|
|
|
|
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