MAR2901CB vs AM29C01-1DC feature comparison

MAR2901CB Dynex Semiconductor

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AM29C01-1DC Rochester Electronics LLC

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Rohs Code No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer GEC PLESSEY SEMICONDUCTORS ROCHESTER ELECTRONICS LLC
Package Description DIP, DIP40,.6 DIP,
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Clock Frequency-Max 25 MHz 33.3 MHz
External Data Bus Width 4 4
JESD-30 Code R-CDIP-T40 R-GDIP-T40
JESD-609 Code e0
Number of Terminals 40 40
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP40,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified
Screening Level 38535Q/M;38534H;883B
Supply Current-Max 10 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
uPs/uCs/Peripheral ICs Type BIT-SLICE MICROPROCESSOR BIT-SLICE MICROPROCESSOR
Base Number Matches 2 1
Length 52.324 mm
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 5.715 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15.24 mm

Compare MAR2901CB with alternatives

Compare AM29C01-1DC with alternatives