MAX1798AEGP
vs
TPS70802PWPR
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
QFN
|
TSSOP
|
| Package Description |
5 X 5 MM, 0.90 MM HEIGHT, QFN-20
|
GREEN, PLASTIC, HTSSOP-20
|
| Pin Count |
20
|
20
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Adjustability |
ADJUSTABLE
|
ADJUSTABLE
|
| Dropout Voltage1-Max |
0.125 V
|
0.14 V
|
| Dropout Voltage1-Nom |
0.073 V
|
0.083 V
|
| Dropout Voltage2-Max |
0.1 V
|
0.14 V
|
| JESD-30 Code |
S-CQCC-N20
|
R-PDSO-G20
|
| JESD-609 Code |
e0
|
|
| Length |
5 mm
|
6.5 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Outputs |
5
|
2
|
| Number of Terminals |
20
|
20
|
| Operating Temperature TJ-Max |
150 °C
|
125 °C
|
| Output Current1-Max |
0.3 A
|
0.25 A
|
| Output Current2-Max |
0.15 A
|
0.125 A
|
| Output Voltage1-Max |
3.3 V
|
5.5 V
|
| Output Voltage1-Min |
1.8 V
|
1.22 V
|
| Output Voltage2-Max |
3.3 V
|
5.5 V
|
| Output Voltage2-Min |
1.8 V
|
1.22 V
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
VQCCN
|
HTSSOP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
245
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Regulator Type |
ADJUSTABLE POSITIVE MULTIPLE OUTPUT LDO REGULATOR
|
ADJUSTABLE POSITIVE MULTIPLE OUTPUT LDO REGULATOR
|
| Seated Height-Max |
1 mm
|
1.2 mm
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
5 mm
|
4.4 mm
|
| Base Number Matches |
1
|
2
|
| Line Regulation-Max (%/V) |
|
0.75
|
| Load Regulation-Max(%) |
|
0.08%
|
| Operating Temperature TJ-Min |
|
-40 °C
|
| Package Equivalence Code |
|
TSSOP20,.25
|
| Packing Method |
|
TR
|
| Technology |
|
CMOS
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare MAX1798AEGP with alternatives
Compare TPS70802PWPR with alternatives