MAX2365ETM+T
vs
ADL5502ACBZ-P7
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
ANALOG DEVICES INC
|
| Part Package Code |
QFN
|
BGA
|
| Package Description |
HVQCCN, LCC48,.27SQ,20
|
WLCSP-8
|
| Pin Count |
48
|
8
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-XQCC-N48
|
S-PBGA-B8
|
| JESD-609 Code |
e3
|
e1
|
| Length |
7 mm
|
1.46 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
48
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
VFBGA
|
| Package Equivalence Code |
LCC48,.27SQ,20
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.8 mm
|
0.625 mm
|
| Supply Current-Max |
0.09 mA
|
|
| Supply Voltage-Nom |
2.8 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
RF AND BASEBAND CIRCUIT
|
RF AND BASEBAND CIRCUIT
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Terminal Form |
NO LEAD
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Width |
7 mm
|
1.46 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
| Manufacturer Package Code |
|
CB-8-3
|
| ECCN Code |
|
EAR99
|
| Samacsys Manufacturer |
|
Analog Devices
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Technology |
|
BICMOS
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MAX2365ETM+T with alternatives
Compare ADL5502ACBZ-P7 with alternatives