MAX2365ETM+T
vs
ZL70102UEJ2
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MICROSEMI CORP
|
| Part Package Code |
QFN
|
|
| Package Description |
HVQCCN, LCC48,.27SQ,20
|
VFBGA, BGA49,7X10,16
|
| Pin Count |
48
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-XQCC-N48
|
R-PBGA-B49
|
| JESD-609 Code |
e3
|
|
| Length |
7 mm
|
4.215 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
48
|
49
|
| Operating Temperature-Max |
85 °C
|
55 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
VFBGA
|
| Package Equivalence Code |
LCC48,.27SQ,20
|
BGA49,7X10,16
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.8 mm
|
0.425 mm
|
| Supply Current-Max |
0.09 mA
|
|
| Supply Voltage-Nom |
2.8 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
RF AND BASEBAND CIRCUIT
|
RF AND BASEBAND CIRCUIT
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN
|
|
| Terminal Form |
NO LEAD
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.4 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Width |
7 mm
|
3.085 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare MAX2365ETM+T with alternatives
Compare ZL70102UEJ2 with alternatives