MAX24310EXG+
vs
MAX24310EXG+
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
Package Description |
10 X 10 MM, ROHS COMPLIANT, CSBGA-81
|
10 X 10 MM, ROHS COMPLIANT, CSBGA-81
|
Reach Compliance Code |
compliant
|
compliant
|
Base Number Matches |
2
|
2
|
Part Package Code |
|
BGA
|
Pin Count |
|
81
|
HTS Code |
|
8542.39.00.01
|
JESD-30 Code |
|
S-PBGA-B81
|
Length |
|
10 mm
|
Number of Functions |
|
1
|
Number of Terminals |
|
81
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
LBGA
|
Package Shape |
|
SQUARE
|
Package Style |
|
GRID ARRAY, LOW PROFILE
|
Peak Reflow Temperature (Cel) |
|
260
|
Seated Height-Max |
|
1.47 mm
|
Supply Voltage-Nom |
|
1.8 V
|
Surface Mount |
|
YES
|
Telecom IC Type |
|
ATM/SONET/SDH SUPPORT CIRCUIT
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Form |
|
BALL
|
Terminal Pitch |
|
1 mm
|
Terminal Position |
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
Width |
|
10 mm
|
|
|
|
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