MAX24310EXG+
vs
ZL30407QCC
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROSEMI CORP
|
| Part Package Code |
BGA
|
QFP
|
| Package Description |
10 X 10 MM, ROHS COMPLIANT, CSBGA-81
|
|
| Pin Count |
81
|
80
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PBGA-B81
|
S-PQFP-G80
|
| Length |
10 mm
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
81
|
80
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
QFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
FLATPACK
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
1.47 mm
|
|
| Supply Voltage-Nom |
1.8 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
ATM/SONET/SDH SUPPORT CIRCUIT
|
ATM/SONET/SDH SUPPORT CIRCUIT
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
1 mm
|
0.635 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
10 mm
|
|
| Base Number Matches |
2
|
3
|
| Package Equivalence Code |
|
QFP80,.64SQ
|
| Qualification Status |
|
Not Qualified
|
| Supply Current-Max |
|
0.155 mA
|
|
|
|
Compare MAX24310EXG+ with alternatives
Compare ZL30407QCC with alternatives