MAX31740ATA+
vs
SA56004AD
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
NXP SEMICONDUCTORS
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.31.00.01
|
|
| Analog IC - Other Type |
ANALOG CIRCUIT
|
|
| JESD-30 Code |
R-PDSO-N8
|
|
| JESD-609 Code |
e3
|
|
| Length |
3 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Channels |
1
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
HVSON
|
|
| Package Equivalence Code |
SOLCC8,.08,20
|
SOP8,.25
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
0.8 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
3 V
|
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
AUTOMOTIVE
|
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
NO LEAD
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
2 mm
|
|
| Base Number Matches |
3
|
2
|
| Pbfree Code |
|
No
|
| Package Description |
|
SOP8,.25
|
| Accuracy-Max (Cel) |
|
1 Cel
|
| Body Breadth |
|
3.9 mm
|
| Body Height |
|
1.35 mm
|
| Body Length or Diameter |
|
4.9 mm
|
| Housing |
|
PLASTIC
|
| Mounting Feature |
|
SURFACE MOUNT
|
| Number of Bits |
|
11
|
| Output Interface Type |
|
2-WIRE INTERFACE
|
| Package Shape/Style |
|
RECTANGULAR
|
| Sensors/Transducers Type |
|
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
|
| Supply Voltage-Max |
|
5.5 V
|
| Supply Voltage-Min |
|
3 V
|
| Termination Type |
|
SOLDER
|
|
|
|
Compare MAX31740ATA+ with alternatives
Compare SA56004AD with alternatives