MAX333AEWP+
vs
DG333DW
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
TEMIC SEMICONDUCTORS
|
| Part Package Code |
20-SOIC_W-300_MIL
|
|
| Package Description |
0.300 INCH, ROHS COMPLIANT, SOIC-20
|
,
|
| Pin Count |
20
|
|
| Manufacturer Package Code |
20-SOIC_W-300_MIL
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| Date Of Intro |
1999-11-04
|
|
| Samacsys Manufacturer |
Analog Devices
|
|
| Analog IC - Other Type |
SPDT
|
SPDT
|
| JESD-30 Code |
R-PDSO-G20
|
R-PDSO-G20
|
| JESD-609 Code |
e3
|
|
| Length |
12.8 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Neg Supply Voltage-Max (Vsup) |
-20 V
|
|
| Neg Supply Voltage-Min (Vsup) |
-4.5 V
|
|
| Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-22 V
|
| Number of Channels |
1
|
1
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
20
|
20
|
| Off-state Isolation-Nom |
72 dB
|
|
| On-state Resistance Match-Nom |
2 Ω
|
|
| On-state Resistance-Max (Ron) |
45 Ω
|
45 Ω
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.65 mm
|
|
| Supply Voltage-Max (Vsup) |
20 V
|
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
|
| Supply Voltage-Nom (Vsup) |
15 V
|
22 V
|
| Surface Mount |
YES
|
YES
|
| Switch-off Time-Max |
145 ns
|
|
| Switch-on Time-Max |
175 ns
|
175 ns
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
7.5 mm
|
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare MAX333AEWP+ with alternatives