MAX354EWE+T
vs
HS1-0548RH-Q
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
HARRIS SEMICONDUCTOR
|
Part Package Code |
SOIC
|
|
Package Description |
SOP, SOP16,.4
|
DIP, DIP16,.3
|
Pin Count |
16
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog IC - Other Type |
SINGLE-ENDED MULTIPLEXER
|
SINGLE-ENDED MULTIPLEXER
|
JESD-30 Code |
R-PDSO-G16
|
R-GDIP-T16
|
JESD-609 Code |
e3
|
e0
|
Length |
10.3 mm
|
|
Moisture Sensitivity Level |
1
|
|
Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
Number of Channels |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
16
|
Off-state Isolation-Nom |
100 dB
|
|
On-state Resistance Match-Nom |
7 Ω
|
|
On-state Resistance-Max (Ron) |
350 Ω
|
1800 Ω
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
Package Code |
SOP
|
DIP
|
Package Equivalence Code |
SOP16,.4
|
DIP16,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.65 mm
|
|
Signal Current-Max |
0.03 A
|
0.008 A
|
Supply Current-Max (Isup) |
0.5 mA
|
3 mA
|
Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
Surface Mount |
YES
|
NO
|
Switch-off Time-Max |
250 ns
|
|
Switch-on Time-Max |
250 ns
|
500 ns
|
Switching |
BREAK-BEFORE-MAKE
|
BREAK-BEFORE-MAKE
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
MILITARY
|
Terminal Finish |
MATTE TIN
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
7.5 mm
|
|
Base Number Matches |
2
|
2
|
|
|
|
Compare MAX354EWE+T with alternatives