MAX4684EBC+T vs MAX4684EBC feature comparison

MAX4684EBC+T Maxim Integrated Products

Buy Now Datasheet

MAX4684EBC Maxim Integrated Products

Buy Now Datasheet
Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MAXIM INTEGRATED PRODUCTS INC MAXIM INTEGRATED PRODUCTS INC
Part Package Code BGA BGA
Package Description VFBGA, BGA12,3X4,20 0.50 MM PITCH, UCSP-12
Pin Count 12 12
Reach Compliance Code compliant not_compliant
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type SPDT SPDT
JESD-30 Code R-PBGA-B12 R-PBGA-B12
JESD-609 Code e1 e0
Length 2.02 mm 2.02 mm
Moisture Sensitivity Level 1 1
Number of Channels 2 1
Number of Functions 1 2
Number of Terminals 12 12
Off-state Isolation-Nom 64 dB 64 dB
On-state Resistance Match-Nom 0.06 Ω 0.06 Ω
On-state Resistance-Max (Ron) 0.8 Ω 0.8 Ω
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output SEPARATE OUTPUT SEPARATE OUTPUT
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA VFBGA
Package Equivalence Code BGA12,3X4,20 BGA12,3X4,20
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 245
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.67 mm 0.67 mm
Supply Voltage-Max (Vsup) 3.3 V 5.5 V
Supply Voltage-Min (Vsup) 2.7 V 1.8 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Switch-off Time-Max 40 ns 30 ns
Switch-on Time-Max 60 ns 50 ns
Switching BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE
Technology BICMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 1.54 mm 1.54 mm
Base Number Matches 2 2

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Compare MAX4684EBC with alternatives