MAX4684EUB
vs
DG2020DV-T1
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Not Recommended
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
VISHAY INTERTECHNOLOGY INC
|
| Part Package Code |
SOIC
|
|
| Package Description |
MICRO, SOP-10
|
TSOP-6
|
| Pin Count |
10
|
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Analog IC - Other Type |
SPDT
|
SPDT
|
| JESD-30 Code |
S-PDSO-N10
|
R-PDSO-G6
|
| JESD-609 Code |
e0
|
e0
|
| Length |
3 mm
|
3.05 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Channels |
1
|
1
|
| Number of Functions |
2
|
1
|
| Number of Terminals |
10
|
6
|
| Off-state Isolation-Nom |
64 dB
|
52 dB
|
| On-state Resistance Match-Nom |
0.06 Ω
|
|
| On-state Resistance-Max (Ron) |
0.8 Ω
|
3.2 Ω
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output |
SEPARATE OUTPUT
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VSON
|
TSSOP
|
| Package Equivalence Code |
TSSOP10,.19,20
|
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
245
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.8 mm
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
3.3 V
|
| Supply Voltage-Min (Vsup) |
1.8 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Switch-off Time-Max |
30 ns
|
5 ns
|
| Switch-on Time-Max |
50 ns
|
10 ns
|
| Switching |
BREAK-BEFORE-MAKE
|
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
1 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
3 mm
|
1.65 mm
|
| Base Number Matches |
1
|
2
|
| Technology |
|
CMOS
|
|
|
|
Compare MAX4684EUB with alternatives
Compare DG2020DV-T1 with alternatives