MAX4800CXZ
vs
MAX4800CXZ-T
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
CSBGA-26
|
6 X 5.30 MM, 1.20 MM HEIGHT, 0.65 MM PITCH, CSBGA-26
|
| Pin Count |
26
|
26
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Analog IC - Other Type |
SPST
|
SPST
|
| JESD-30 Code |
R-PBGA-B26
|
R-PBGA-B26
|
| Length |
6 mm
|
6 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Normal Position |
NO
|
NO
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
26
|
26
|
| Off-state Isolation-Nom |
33 dB
|
77 dB
|
| On-state Resistance Match-Nom |
1.9 Ω
|
1.3 Ω
|
| On-state Resistance-Max (Ron) |
38 Ω
|
38 Ω
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFBGA
|
LFBGA
|
| Package Equivalence Code |
BGA26,8X9,25
|
BGA26,8X9,25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.32 mm
|
1.32 mm
|
| Supply Voltage-Max (Vsup) |
13.2 V
|
13.2 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Switch-off Time-Max |
5000 ns
|
5000 ns
|
| Switch-on Time-Max |
5000 ns
|
5000 ns
|
| Technology |
BCDMOS
|
BCDMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
5.35 mm
|
5.35 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare MAX4800CXZ with alternatives
Compare MAX4800CXZ-T with alternatives