MAX4888AETI+TG3U
vs
MAX4888CETI+
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Package Description |
,
|
HVQCCN, LCC28,.14X.22,20
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SPDT
|
DPDT
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Base Number Matches |
1
|
2
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
QFN
|
| Pin Count |
|
28
|
| ECCN Code |
|
EAR99
|
| JESD-30 Code |
|
R-XQCC-N28
|
| JESD-609 Code |
|
e3
|
| Length |
|
5.5 mm
|
| Moisture Sensitivity Level |
|
1
|
| Number of Channels |
|
2
|
| Number of Functions |
|
2
|
| Number of Terminals |
|
28
|
| Off-state Isolation-Nom |
|
15 dB
|
| On-state Resistance Match-Nom |
|
0.2 Ω
|
| On-state Resistance-Max (Ron) |
|
8.4 Ω
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output |
|
SEPARATE OUTPUT
|
| Package Body Material |
|
UNSPECIFIED
|
| Package Code |
|
HVQCCN
|
| Package Equivalence Code |
|
LCC28,.14X.22,20
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
0.8 mm
|
| Supply Voltage-Max (Vsup) |
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
|
3 V
|
| Supply Voltage-Nom (Vsup) |
|
3.3 V
|
| Surface Mount |
|
YES
|
| Switching |
|
BREAK-BEFORE-MAKE
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
MATTE TIN
|
| Terminal Form |
|
NO LEAD
|
| Terminal Pitch |
|
0.5 mm
|
| Terminal Position |
|
QUAD
|
| Width |
|
3.5 mm
|
|
|
|
Compare MAX4888AETI+TG3U with alternatives
Compare MAX4888CETI+ with alternatives