MAX6958BAEE+
vs
TB62779FNG
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
TOSHIBA CORP
|
Part Package Code |
SOIC
|
SSOP
|
Package Description |
0.150 INCH, EXPOSED PAD, QSOP-16
|
0.225 INCH, 0.65 MM PITCH, ROHS COMPLIANT, PLASTIC, SSOP-20
|
Pin Count |
16
|
20
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
COMMON-CATHODE
|
COMMON-ANODE
|
Data Input Mode |
SERIAL
|
|
Display Mode |
SEGMENT
|
SEGMENT
|
Interface IC Type |
LED DISPLAY DRIVER
|
LED DISPLAY DRIVER
|
JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G20
|
JESD-609 Code |
e3
|
|
Length |
4.9 mm
|
|
Moisture Sensitivity Level |
1
|
|
Multiplexed Display Capability |
YES
|
|
Number of Digits/Characters |
4-DIGIT
|
|
Number of Functions |
1
|
|
Number of Segments |
9
|
9
|
Number of Terminals |
16
|
20
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HSSOP
|
SSOP
|
Package Equivalence Code |
SSOP16,.25
|
SSOP20,.25
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.75 mm
|
|
Supply Voltage-Max |
5.5 V
|
|
Supply Voltage-Min |
3 V
|
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
BICMOS
|
Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.635 mm
|
0.635 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
Width |
3.9 mm
|
|
Base Number Matches |
4
|
2
|
|
|
|
Compare MAX6958BAEE+ with alternatives
Compare TB62779FNG with alternatives