MAX705C/D+
vs
MAX708CPA+
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
DIE
|
DIP
|
| Package Description |
DIE,
|
LEAD FREE, PLASTIC, DIP-8
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Adjustable Threshold |
YES
|
NO
|
| Analog IC - Other Type |
VOLTAGE SUPERVISOR/RESET IC
|
VOLTAGE SUPERVISOR/RESET IC
|
| JESD-30 Code |
R-XUUC-N8
|
R-PDIP-T8
|
| Number of Channels |
2
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
DIE
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
UNCASED CHIP
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1 V
|
1 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
| Terminal Position |
UPPER
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Base Number Matches |
1
|
2
|
| Pbfree Code |
|
Yes
|
| JESD-609 Code |
|
e3
|
| Length |
|
9.375 mm
|
| Moisture Sensitivity Level |
|
1
|
| Package Equivalence Code |
|
DIP8,.3
|
| Seated Height-Max |
|
4.572 mm
|
| Supply Current-Max (Isup) |
|
0.35 mA
|
| Terminal Finish |
|
MATTE TIN
|
| Terminal Pitch |
|
2.54 mm
|
| Threshold Voltage-Nom |
|
+4.4V
|
| Width |
|
7.62 mm
|
|
|
|
Compare MAX705C/D+ with alternatives
Compare MAX708CPA+ with alternatives