MAX708SEUA
vs
ASM813LCSAF
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
PULSECORE SEMICONDUCTOR
|
| Part Package Code |
TSSOP
|
|
| Package Description |
MO-187CAA, MICRO, MAX, PACKAGE-8
|
LEAD FREE, SOP-8
|
| Pin Count |
8
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| Additional Feature |
MANUAL RESET, POWER FAIL COMPARATOR
|
BAT BUP SW:N;MNL RST:Y;OV DET:N;PW FL IP:N;PW FL IO:N;PW FL OP:N;PRG RST DLY:N;UV DET:N;WD:N;WWD:N
|
| Adjustable Threshold |
NO
|
NO
|
| Analog IC - Other Type |
POWER SUPPLY SUPPORT CIRCUIT
|
VOLTAGE SUPERVISOR/RESET IC
|
| JESD-30 Code |
S-PDSO-G8
|
R-PDSO-G8
|
| JESD-609 Code |
e0
|
e3/e6
|
| Length |
3 mm
|
4.9 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
SOP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
245
|
260
|
| Seated Height-Max |
1.1 mm
|
1.75 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.2 V
|
1.1 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
MATTE TIN/TIN BISMUTH
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
40
|
| Width |
3 mm
|
3.91 mm
|
| Base Number Matches |
2
|
3
|
| Qualification Status |
|
Not Qualified
|
| Threshold Voltage-Nom |
|
+4.65V
|
|
|
|
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