MAX709LCPA+
vs
SP705CU
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
EXAR CORP
|
| Part Package Code |
8-PDIP-300_MIL
|
TSSOP
|
| Package Description |
LEAD FREE, PLASTIC, DIP-8
|
TSSOP, TSSOP8,.19
|
| Pin Count |
8
|
8
|
| Manufacturer Package Code |
8-PDIP-300_MIL
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| Date Of Intro |
1999-05-26
|
|
| Samacsys Manufacturer |
Analog Devices
|
|
| Adjustable Threshold |
NO
|
NO
|
| Analog IC - Other Type |
VOLTAGE SUPERVISOR/RESET IC
|
VOLTAGE SUPERVISOR/RESET IC
|
| JESD-30 Code |
R-PDIP-T8
|
S-PDSO-G8
|
| JESD-609 Code |
e3
|
|
| Length |
9.375 mm
|
3 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.572 mm
|
1.1 mm
|
| Supply Current-Max (Isup) |
0.15 mA
|
0.06 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1 V
|
4.75 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Threshold Voltage-Nom |
+4.65V
|
+4.65V
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
7.62 mm
|
3 mm
|
| Base Number Matches |
2
|
2
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| Package Equivalence Code |
|
TSSOP8,.19
|
|
|
|
Compare MAX709LCPA+ with alternatives
Compare SP705CU with alternatives