MAX7311ATG+GH7
vs
TCA6416ZQSR
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
TEXAS INSTRUMENTS INC
|
| Package Description |
TQFN-24
|
BGA-24
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Clock Frequency-Max |
0.4 MHz
|
0.4 MHz
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PQCC-N24
|
S-PBGA-B24
|
| Length |
4 mm
|
3 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of I/O Lines |
16
|
16
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
VFBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Seated Height-Max |
0.8 mm
|
1 mm
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
2 V
|
1.65 V
|
| Supply Voltage-Nom |
3.3 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Width |
4 mm
|
3 mm
|
| uPs/uCs/Peripheral ICs Type |
PARALLEL IO PORT, GENERAL PURPOSE
|
PARALLEL IO PORT, GENERAL PURPOSE
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
24
|
| JESD-609 Code |
|
e1
|
| Number of Bits |
|
16
|
| Package Equivalence Code |
|
BGA24,5X5,20
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Supply Current-Max |
|
0.03 mA
|
| Terminal Finish |
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MAX7311ATG+GH7 with alternatives
Compare TCA6416ZQSR with alternatives