MAX741DCPP
vs
MAX741NEAP-T
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
DIP
|
SOIC
|
| Package Description |
PLASTIC, DIP-20
|
SSOP,
|
| Pin Count |
20
|
20
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.31.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Analog IC - Other Type |
SWITCHING CONTROLLER
|
SWITCHING CONTROLLER
|
| Control Mode |
CURRENT-MODE
|
CURRENT-MODE
|
| Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
| Input Voltage-Max |
15.5 V
|
15.5 V
|
| Input Voltage-Min |
2.7 V
|
2.7 V
|
| JESD-30 Code |
R-PDIP-T20
|
R-PDSO-G20
|
| JESD-609 Code |
e0
|
e0
|
| Length |
26.16 mm
|
7.2 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Current-Max |
1 A
|
1 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SSOP
|
| Package Equivalence Code |
DIP20,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE, SHRINK PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.572 mm
|
1.99 mm
|
| Supply Current-Max (Isup) |
4.25 mA
|
4 mA
|
| Surface Mount |
NO
|
YES
|
| Switcher Configuration |
PUSH-PULL
|
PUSH-PULL
|
| Switching Frequency-Max |
160 kHz
|
160 kHz
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
5.29 mm
|
| Base Number Matches |
1
|
1
|
| Moisture Sensitivity Level |
|
1
|
|
|
|
Compare MAX741DCPP with alternatives
Compare MAX741NEAP-T with alternatives