MAX77751GEFG+T
vs
MAX77751HEFG+
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
ANALOG DEVICES INC
|
| Part Package Code |
24-LFCSP-3X3X0.55
|
24-LFCSP-3X3X0.55
|
| Package Description |
FC2QFN-24
|
FC2QFN-24
|
| Pin Count |
24
|
24
|
| Manufacturer Package Code |
24-LFCSP-3X3X0.55
|
24-LFCSP-3X3X0.55
|
| Reach Compliance Code |
compliant
|
compliant
|
| Date Of Intro |
2020-07-24
|
2020-07-24
|
| Samacsys Manufacturer |
Analog Devices
|
Analog Devices
|
| Adjustable Threshold |
YES
|
YES
|
| Analog IC - Other Type |
POWER SUPPLY SUPPORT CIRCUIT
|
POWER SUPPLY SUPPORT CIRCUIT
|
| JESD-30 Code |
S-XQCC-N24
|
S-XQCC-N24
|
| JESD-609 Code |
e3
|
e3
|
| Length |
3 mm
|
3 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
VQCCN
|
VQCCN
|
| Package Equivalence Code |
LCC24,.12SQ,16
|
LCC24,.12SQ,16
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, VERY THIN PROFILE
|
CHIP CARRIER, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
0.6 mm
|
0.6 mm
|
| Supply Current-Max (Isup) |
4 mA
|
4 mA
|
| Supply Voltage-Max (Vsup) |
13.7 V
|
13.7 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
Matte Tin (Sn)
|
Matte Tin (Sn)
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.4 mm
|
0.4 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Threshold Voltage-Nom |
+13.7V
|
+13.7V
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
3 mm
|
3 mm
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare MAX77751GEFG+T with alternatives
Compare MAX77751HEFG+ with alternatives