MAX803LEXR+T
vs
MCP120-475HI/TO
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
SOIC
|
TO-92
|
Package Description |
TSSOP, SOT-323
|
PLASTIC, TO-92, 3 PIN
|
Pin Count |
3
|
3
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.31.00.01
|
8542.39.00.01
|
Adjustable Threshold |
NO
|
NO
|
Analog IC - Other Type |
VOLTAGE SUPERVISOR/RESET IC
|
VOLTAGE SUPERVISOR/RESET IC
|
JESD-30 Code |
R-PDSO-G3
|
O-PBCY-T3
|
JESD-609 Code |
e3
|
e3
|
Length |
2 mm
|
|
Moisture Sensitivity Level |
1
|
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
3
|
3
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TO-92
|
Package Equivalence Code |
TSSOP3/6,.08
|
SIP3,.1,50
|
Package Shape |
RECTANGULAR
|
ROUND
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
CYLINDRICAL
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.1 mm
|
|
Supply Current-Max (Isup) |
0.06 mA
|
0.06 mA
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
1.2 V
|
1 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Pitch |
0.65 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
BOTTOM
|
Threshold Voltage-Nom |
+4.63 V
|
+4.63V
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
1.25 mm
|
|
Base Number Matches |
4
|
1
|
Factory Lead Time |
|
7 Weeks
|
Samacsys Manufacturer |
|
Microchip
|
Technology |
|
CMOS
|
|
|
|
Compare MAX803LEXR+T with alternatives
Compare MCP120-475HI/TO with alternatives