MAX825ZEXK
vs
MAX825ZEXK+T
feature comparison
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Life Cycle Code |
|
Transferred
|
| Ihs Manufacturer |
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
|
SOIC
|
| Package Description |
|
ROHS COMPLIANT, SC-70, 5 PIN
|
| Pin Count |
|
5
|
| Reach Compliance Code |
|
compliant
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| Additional Feature |
|
BAT BUP SW:N;MNL RST:Y;OV DET:N;PW FL IP:N;PW FL IO:N;PW FL OP:N;PRG RST DLY:N;UV DET:N;WD:Y;WWD:N
|
| Adjustable Threshold |
|
NO
|
| Analog IC - Other Type |
|
VOLTAGE SUPERVISOR/RESET IC
|
| JESD-30 Code |
|
R-PDSO-G5
|
| JESD-609 Code |
|
e3
|
| Length |
|
2 mm
|
| Moisture Sensitivity Level |
|
1
|
| Number of Channels |
|
1
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
5
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TSSOP
|
| Package Equivalence Code |
|
TSSOP5/6,.08
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.1 mm
|
| Supply Current-Max (Isup) |
|
0.006 mA
|
| Supply Voltage-Max (Vsup) |
|
2.75 V
|
| Supply Voltage-Min (Vsup) |
|
2.38 V
|
| Supply Voltage-Nom (Vsup) |
|
2.5 V
|
| Surface Mount |
|
YES
|
| Technology |
|
BICMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
MATTE TIN
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.65 mm
|
| Terminal Position |
|
DUAL
|
| Threshold Voltage-Nom |
|
+2.32V
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
1.25 mm
|
| Base Number Matches |
|
2
|
|
|
|
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