MAX9120EXK+T
vs
TLV4021S5MYKAR
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
SOIC
|
|
| Package Description |
TSSOP, TSSOP5/6,.08
|
DSBGA-4
|
| Pin Count |
5
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Amplifier Type |
COMPARATOR
|
COMPARATOR
|
| Average Bias Current-Max (IIB) |
0.002 µA
|
|
| Bias Current-Max (IIB) @25C |
0.001 µA
|
0.005 µA
|
| Input Offset Voltage-Max |
10000 µV
|
4000 µV
|
| JESD-30 Code |
R-PDSO-G5
|
S-XBGA-B4
|
| JESD-609 Code |
e3
|
e1
|
| Length |
2 mm
|
0.73 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
5
|
4
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Type |
OPEN-DRAIN
|
OPEN-DRAIN
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
TSSOP
|
VFBGA
|
| Package Equivalence Code |
TSSOP5/6,.08
|
BGA4,2X2,14
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.1 mm
|
0.4 mm
|
| Supply Current-Max |
0.0012 mA
|
0.005 mA
|
| Supply Voltage Limit-Max |
6 V
|
6 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
MATTE TIN
|
TIN SILVER COPPER
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.65 mm
|
0.35 mm
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
1.25 mm
|
0.73 mm
|
| Base Number Matches |
2
|
1
|
| Packing Method |
|
TR
|
| Response Time-Nom |
|
2000 ns
|
|
|
|
Compare MAX9120EXK+T with alternatives
Compare TLV4021S5MYKAR with alternatives