MB82D01161-85PBT vs IS31WV16100-70B feature comparison

MB82D01161-85PBT FUJITSU Semiconductor Limited

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IS31WV16100-70B Integrated Silicon Solution Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FUJITSU SEMICONDUCTOR AMERICA INC INTEGRATED SILICON SOLUTION INC
Part Package Code BGA BGA
Package Description 0.80 MM PITCH, PLASTIC, FBGA-48 LFBGA,
Pin Count 48 48
Reach Compliance Code unknown compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 85 ns 70 ns
JESD-30 Code R-PBGA-B48 R-PBGA-B48
Length 9 mm 8 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type STANDARD SRAM PSEUDO STATIC RAM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -30 °C
Organization 1MX16 1MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA LFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.35 mm
Supply Voltage-Max (Vsup) 2.7 V 3.6 V
Supply Voltage-Min (Vsup) 2.3 V 1.65 V
Supply Voltage-Nom (Vsup) 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.75 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 6 mm 6 mm
Base Number Matches 2 1
Pbfree Code No
Rohs Code No
JESD-609 Code e0
Terminal Finish TIN LEAD

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Compare IS31WV16100-70B with alternatives