MB82D01171A-90LPBT vs MB82D01171B-70LLPBN feature comparison

MB82D01171A-90LPBT FUJITSU Semiconductor Limited

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MB82D01171B-70LLPBN FUJITSU Limited

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FUJITSU SEMICONDUCTOR AMERICA INC FUJITSU LTD
Part Package Code BGA BGA
Package Description PLASTIC, FBGA-48 TFBGA, BGA48,6X8,30
Pin Count 48 48
Reach Compliance Code unknown compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 90 ns 70 ns
Additional Feature IT CAN ALSO OPERATE WITH 2.7V TO 3.1V SUPPLY
JESD-30 Code R-PBGA-B48 R-PBGA-B48
Length 9 mm 9 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type STANDARD SRAM PSEUDO STATIC RAM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -30 °C
Organization 1MX16 1MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 2.7 V 2.7 V
Supply Voltage-Min (Vsup) 2.3 V 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.75 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 6 mm 6 mm
Base Number Matches 2 2
Rohs Code No
I/O Type COMMON
JESD-609 Code e0
Output Characteristics 3-STATE
Package Equivalence Code BGA48,6X8,30
Standby Current-Max 0.00007 A
Supply Current-Max 0.02 mA
Terminal Finish TIN LEAD

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