MB82D01171A-90LPBT vs W964A6BBN70E feature comparison

MB82D01171A-90LPBT FUJITSU Semiconductor Limited

Buy Now Datasheet

W964A6BBN70E Winbond Electronics Corp

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FUJITSU SEMICONDUCTOR AMERICA INC WINBOND ELECTRONICS CORP
Part Package Code BGA BGA
Package Description PLASTIC, FBGA-48 TFBGA, BGA48,6X8,30
Pin Count 48 48
Reach Compliance Code unknown compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 90 ns 65 ns
Additional Feature IT CAN ALSO OPERATE WITH 2.7V TO 3.1V SUPPLY
JESD-30 Code R-PBGA-B48 R-PBGA-B48
Length 9 mm 8 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type STANDARD SRAM PSEUDO STATIC RAM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -25 °C
Organization 1MX16 1MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.1 mm
Supply Voltage-Max (Vsup) 2.7 V 2.7 V
Supply Voltage-Min (Vsup) 2.3 V 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.75 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 6 mm 6 mm
Base Number Matches 2 1
I/O Type COMMON
JESD-609 Code e1
Output Characteristics 3-STATE
Package Equivalence Code BGA48,6X8,30
Standby Current-Max 0.00007 A
Supply Current-Max 0.02 mA
Terminal Finish TIN SILVER COPPER

Compare MB82D01171A-90LPBT with alternatives

Compare W964A6BBN70E with alternatives