MB84256C-70P vs CY62256NL-70PXC feature comparison

MB84256C-70P FUJITSU Semiconductor Limited

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CY62256NL-70PXC Rochester Electronics LLC

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer FUJITSU SEMICONDUCTOR AMERICA INC ROCHESTER ELECTRONICS LLC
Package Description DIP, 0.600 INCH, LEAD FREE, MS-011, DIP-28
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.32.00.41
Access Time-Max 70 ns 70 ns
JESD-30 Code R-PDIP-T28 R-PDIP-T28
Length 35.73 mm 36.322 mm
Memory Density 262144 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Ports 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 32KX8 32KX8
Output Characteristics 3-STATE
Output Enable YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified COMMERCIAL
Seated Height-Max 4.96 mm 5.08 mm
Standby Voltage-Min 2 V
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 2 2
Pbfree Code Yes
Rohs Code Yes
Part Package Code DIP
Pin Count 28
JESD-609 Code e3
Moisture Sensitivity Level NOT SPECIFIED
Peak Reflow Temperature (Cel) 260
Terminal Finish MATTE TIN
Time@Peak Reflow Temperature-Max (s) 20

Compare MB84256C-70P with alternatives

Compare CY62256NL-70PXC with alternatives