MB84VD22184EE-90-PBS
vs
AM49DL324BGT85T
feature comparison
Pbfree Code |
No
|
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
FUJITSU SEMICONDUCTOR AMERICA INC
|
ADVANCED MICRO DEVICES INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
LFBGA,
|
LFBGA, BGA73,10X12,32
|
Pin Count |
73
|
73
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.71
|
8542.32.00.71
|
Additional Feature |
256K X 16 SRAM ALSO AVAILABLE
|
FLASH IS ALSO CONFIGURABLE AS 4M X 8; SRAM IS ORGANIZED AS 2M X 16
|
JESD-30 Code |
R-PBGA-B73
|
R-PBGA-B73
|
Length |
11.6 mm
|
11.6 mm
|
Memory Density |
33554432 bit
|
33554432 bit
|
Memory IC Type |
MEMORY CIRCUIT
|
MEMORY CIRCUIT
|
Memory Width |
16
|
16
|
Number of Functions |
1
|
1
|
Number of Terminals |
73
|
73
|
Number of Words |
2097152 words
|
2097152 words
|
Number of Words Code |
2000000
|
2000000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-25 °C
|
-40 °C
|
Organization |
2MX16
|
2MX16
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
LFBGA
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.4 mm
|
1.4 mm
|
Supply Voltage-Max (Vsup) |
3.3 V
|
3.3 V
|
Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
8 mm
|
8 mm
|
Base Number Matches |
2
|
2
|
Access Time-Max |
|
85 ns
|
Mixed Memory Type |
|
FLASH+PSRAM
|
Package Equivalence Code |
|
BGA73,10X12,32
|
Standby Current-Max |
|
0.000005 A
|
Supply Current-Max |
|
0.045 mA
|
|
|
|
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