MB89P585BPFV
vs
MB89P585BPFV
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
FUJITSU LTD
|
FUJITSU SEMICONDUCTOR AMERICA INC
|
Part Package Code |
QFP
|
QFP
|
Package Description |
LQFP, QFP64,.47SQ,20
|
LFQFP,
|
Pin Count |
64
|
64
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
YES
|
NO
|
Address Bus Width |
|
|
Bit Size |
8
|
8
|
CPU Family |
F2MC-8L
|
|
Clock Frequency-Max |
6.25 MHz
|
6.25 MHz
|
DAC Channels |
YES
|
NO
|
DMA Channels |
YES
|
YES
|
External Data Bus Width |
|
|
JESD-30 Code |
S-PQFP-G64
|
S-PQFP-G64
|
JESD-609 Code |
e0
|
|
Length |
12 mm
|
10 mm
|
Number of I/O Lines |
53
|
53
|
Number of Terminals |
64
|
64
|
On Chip Program ROM Width |
8
|
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LQFP
|
LFQFP
|
Package Equivalence Code |
QFP64,.47SQ,20
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, LOW PROFILE
|
FLATPACK, LOW PROFILE, FINE PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
1024
|
|
ROM (words) |
16384
|
|
ROM Programmability |
OTPROM
|
OTPROM
|
Seated Height-Max |
1.7 mm
|
1.7 mm
|
Speed |
12.5 MHz
|
12.5 MHz
|
Supply Current-Max |
38 mA
|
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
3 V
|
3 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
12 mm
|
10 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
No
|
|
|
|