MB95F222HPF-G-SNE1 vs MC9S08QD2MPC feature comparison

MB95F222HPF-G-SNE1 FUJITSU Limited

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MC9S08QD2MPC Freescale Semiconductor

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer FUJITSU LTD FREESCALE SEMICONDUCTOR INC
Package Description 10.15 X 5.30 MM, 2.25 MM HEIGHT, 1.27 MM PITCH, PLASTIC, SOP-16 ROHS COMPLIANT, PLASTIC, DIP-8
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2 EAR99
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC YES YES
Address Bus Width
Bit Size 8 8
CPU Family F2MC-8
Clock Frequency-Max 32.5 MHz 16 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code R-PDSO-G16 R-PDIP-T8
Length 10.15 mm 9.779 mm
Number of I/O Lines 12 6
Number of Terminals 16 8
On Chip Program ROM Width 8 8
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Equivalence Code SOP16,.3 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
RAM (bytes) 240 128
ROM (words) 4096 2048
ROM Programmability FLASH FLASH
Seated Height-Max 2.25 mm 5.334 mm
Speed 16.25 MHz 16 MHz
Supply Current-Max 39.5 mA 2.2 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 2.7 V
Supply Voltage-Nom 5 V 3 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 5.3 mm 7.62 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 4 2
Pbfree Code Yes
Part Package Code DIP
Pin Count 8
Samacsys Manufacturer NXP
JESD-609 Code e3
Terminal Finish MATTE TIN

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