MB95F222HPF-G-SNE1 vs MC9S08QD2VSC feature comparison

MB95F222HPF-G-SNE1 FUJITSU Limited

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MC9S08QD2VSC NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer FUJITSU LTD NXP SEMICONDUCTORS
Package Description 10.15 X 5.30 MM, 2.25 MM HEIGHT, 1.27 MM PITCH, PLASTIC, SOP-16 ROHS COMPLIANT, MS-012AA, SOIC-8
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC YES YES
Address Bus Width
Bit Size 8 8
CPU Family F2MC-8
Clock Frequency-Max 32.5 MHz 16 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code R-PDSO-G16 R-PDSO-G8
Length 10.15 mm 4.9 mm
Number of I/O Lines 12 4
Number of Terminals 16 8
On Chip Program ROM Width 8 8
Operating Temperature-Max 85 °C 105 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP16,.3 SOP8,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Qualification Status Not Qualified Not Qualified
RAM (bytes) 240 128
ROM (words) 4096 2048
ROM Programmability FLASH FLASH
Seated Height-Max 2.25 mm 1.75 mm
Speed 16.25 MHz 16 MHz
Supply Current-Max 39.5 mA 2.2 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 40
Width 5.3 mm 3.9 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 4 2
Factory Lead Time 13 Weeks
Samacsys Manufacturer NXP
Additional Feature IT ALSO OPERATES AT 3V SUPPLY
JESD-609 Code e3
Moisture Sensitivity Level 3
Terminal Finish Tin (Sn)

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