MB95F222HPF-G-SNE1
vs
MC9S08SH4MWJR
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
FUJITSU LTD
|
NXP SEMICONDUCTORS
|
Package Description |
10.15 X 5.30 MM, 2.25 MM HEIGHT, 1.27 MM PITCH, PLASTIC, SOP-16
|
1.27 MM PITCH, MS-013AC, SOIC-20
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.A.2
|
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
YES
|
YES
|
Address Bus Width |
|
|
Bit Size |
8
|
8
|
CPU Family |
F2MC-8
|
|
Clock Frequency-Max |
32.5 MHz
|
16 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
|
|
JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G20
|
Length |
10.15 mm
|
12.8 mm
|
Number of I/O Lines |
12
|
17
|
Number of Terminals |
16
|
20
|
On Chip Program ROM Width |
8
|
8
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
SOP
|
Package Equivalence Code |
SOP16,.3
|
SOP20,.4
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
240
|
256
|
ROM (words) |
4096
|
4096
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
2.25 mm
|
|
Speed |
16.25 MHz
|
40 MHz
|
Supply Current-Max |
39.5 mA
|
7.7 mA
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
2.7 V
|
Supply Voltage-Nom |
5 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
5.3 mm
|
7.5 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
4
|
2
|
Boundary Scan |
|
NO
|
|
|
|
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