MB95F222KPF-G-SNE1 vs MC9S08SH8MFK feature comparison

MB95F222KPF-G-SNE1 Spansion

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MC9S08SH8MFK NXP Semiconductors

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Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer SPANSION INC NXP SEMICONDUCTORS
Package Description SOP,
Reach Compliance Code unknown unknown
ECCN Code 3A991.A
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC YES
Address Bus Width
Bit Size 8
Clock Frequency-Max 32.5 MHz
DAC Channels NO
DMA Channels NO
External Data Bus Width
JESD-30 Code R-PDSO-G16
Length 10.15 mm
Number of I/O Lines 13
Number of Terminals 16
On Chip Program ROM Width 8
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
PWM Channels YES
Package Body Material PLASTIC/EPOXY
Package Code SOP
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
ROM (words) 4096
ROM Programmability FLASH
Seated Height-Max 2.25 mm
Speed 16.25 MHz
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4.5 V
Supply Voltage-Nom 5 V
Surface Mount YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL
Terminal Form GULL WING
Terminal Pitch 1.27 mm
Terminal Position DUAL
Width 5.3 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 4 2
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40

Compare MB95F222KPF-G-SNE1 with alternatives

Compare MC9S08SH8MFK with alternatives