MBM100480-25 vs MAR5114CB feature comparison

MBM100480-25 FUJITSU Limited

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MAR5114CB Plessey Semiconductors Ltd

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FUJITSU SEMICONDUCTOR AMERICA INC GEC PLESSEY SEMICONDUCTORS
Part Package Code DFP
Package Description DFP, DIP, DIP18,.3
Pin Count 20
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.32.00.41
Access Time-Max 25 ns 135 ns
JESD-30 Code R-GDFP-F20 R-CDIP-T18
Memory Density 16384 bit 4096 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 1 4
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 20 18
Number of Words 16384 words 1024 words
Number of Words Code 16000 1000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -55 °C
Organization 16KX1 1KX4
Output Characteristics OPEN-EMITTER 3-STATE
Output Enable NO NO
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code DFP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Surface Mount YES NO
Technology ECL CMOS
Temperature Grade OTHER MILITARY
Terminal Form FLAT THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 6 2
Rohs Code No
I/O Type COMMON
JESD-609 Code e0
Package Equivalence Code DIP18,.3
Screening Level 38535Q/M;38534H;883B
Standby Current-Max 0.002 A
Standby Voltage-Min 2 V
Supply Current-Max 0.035 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 2.54 mm
Total Dose 100k Rad(Si) V

Compare MBM100480-25 with alternatives

Compare MAR5114CB with alternatives