MBM100480-25
vs
MAR5114CB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
FUJITSU SEMICONDUCTOR AMERICA INC
GEC PLESSEY SEMICONDUCTORS
Part Package Code
DFP
Package Description
DFP,
DIP, DIP18,.3
Pin Count
20
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.41
Access Time-Max
25 ns
135 ns
JESD-30 Code
R-GDFP-F20
R-CDIP-T18
Memory Density
16384 bit
4096 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
1
4
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
20
18
Number of Words
16384 words
1024 words
Number of Words Code
16000
1000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
16KX1
1KX4
Output Characteristics
OPEN-EMITTER
3-STATE
Output Enable
NO
NO
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
DFP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
NO
Technology
ECL
CMOS
Temperature Grade
OTHER
MILITARY
Terminal Form
FLAT
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
6
2
Rohs Code
I/O Type
COMMON
JESD-609 Code
e0
Package Equivalence Code
DIP18,.3
Screening Level
38535Q/M;38534H;883B
Standby Current-Max
0.002 A
Standby Voltage-Min
2 V
Supply Current-Max
0.035 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Pitch
2.54 mm
Total Dose
100k Rad(Si) V
Compare MBM100480-25 with alternatives
Compare MAR5114CB with alternatives