MBM2764-30 vs AM27C64-305DI feature comparison

MBM2764-30 FUJITSU Limited

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AM27C64-305DI AMD

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FUJITSU SEMICONDUCTOR AMERICA INC ADVANCED MICRO DEVICES INC
Part Package Code QFJ DIP
Package Description WQCCN, WDIP, DIP28,.6
Pin Count 32 28
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 300 ns 300 ns
JESD-30 Code R-CQCC-N32 R-GDIP-T28
Length 13.97 mm 37.1475 mm
Memory Density 65536 bit 65536 bit
Memory IC Type UVPROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 28
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 8KX8 8KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code WQCCN WDIP
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER, WINDOW IN-LINE, WINDOW
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.3 mm 5.588 mm
Supply Current-Max 0.1 mA 0.03 mA
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology NMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form NO LEAD THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position QUAD DUAL
Width 11.43 mm 15.24 mm
Base Number Matches 7 2
Pbfree Code No
Rohs Code No
I/O Type COMMON
Package Equivalence Code DIP28,.6
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programming Voltage 12.5 V
Standby Current-Max 0.0001 A
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare MBM2764-30 with alternatives

Compare AM27C64-305DI with alternatives