MBM2764-30 vs TS27C64A-30XCQ feature comparison

MBM2764-30 FUJITSU Limited

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TS27C64A-30XCQ STMicroelectronics

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FUJITSU SEMICONDUCTOR AMERICA INC STMICROELECTRONICS
Part Package Code QFJ DIP
Package Description WQCCN, CERAMIC, FDIP-28
Pin Count 32 28
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 300 ns 300 ns
JESD-30 Code R-CQCC-N32 R-GDIP-T28
Length 13.97 mm
Memory Density 65536 bit 65536 bit
Memory IC Type UVPROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 28
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 8KX8 8KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code WQCCN WDIP
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER, WINDOW IN-LINE, WINDOW
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.3 mm 5.71 mm
Supply Current-Max 0.1 mA 0.03 mA
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology NMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form NO LEAD THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position QUAD DUAL
Width 11.43 mm 15.24 mm
Base Number Matches 7 1
Pbfree Code No
Rohs Code No
I/O Type COMMON
JESD-609 Code e0
Package Equivalence Code DIP28,.6
Programming Voltage 12.5 V
Standby Current-Max 0.0001 A
Terminal Finish TIN LEAD

Compare MBM2764-30 with alternatives

Compare TS27C64A-30XCQ with alternatives