MBM27C512-25WZ vs AM27C512L-250/BXA feature comparison

MBM27C512-25WZ FUJITSU Limited

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AM27C512L-250/BXA AMD

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FUJITSU SEMICONDUCTOR AMERICA INC ADVANCED MICRO DEVICES INC
Part Package Code DIP DIP
Package Description WDIP, WDIP, DIP28,.6
Pin Count 28 28
Reach Compliance Code unknown unknown
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 250 ns 250 ns
JESD-30 Code R-GDIP-T28 R-GDIP-T28
Length 36.83 mm 37.1475 mm
Memory Density 524288 bit 524288 bit
Memory IC Type UVPROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 64KX8 64KX8
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code WDIP WDIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE, WINDOW IN-LINE, WINDOW
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.84 mm 5.588 mm
Supply Current-Max 0.03 mA 0.025 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 2 1
Pbfree Code No
Rohs Code No
I/O Type COMMON
JESD-609 Code e0
Output Characteristics 3-STATE
Package Equivalence Code DIP28,.6
Screening Level 38535Q/M;38534H;883B
Standby Current-Max 0.00004 A
Terminal Finish TIN LEAD

Compare MBM27C512-25WZ with alternatives

Compare AM27C512L-250/BXA with alternatives