MBR10100MFST3G
vs
G10100F5
feature comparison
Pbfree Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
ONSEMI
|
LITE-ON SEMICONDUCTOR CORP
|
Part Package Code |
DFN5 5X6, 1.27P (SO 8FL)
|
|
Package Description |
SO-8FL, DFN5, 6 PIN
|
F5-PAK-3
|
Manufacturer Package Code |
488AA
|
|
Reach Compliance Code |
not_compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.80
|
8541.10.00.80
|
Factory Lead Time |
66 Weeks
|
|
Samacsys Manufacturer |
onsemi
|
|
Additional Feature |
LOW POWER LOSS
|
|
Application |
EFFICIENCY
|
GENERAL PURPOSE
|
Case Connection |
CATHODE
|
CATHODE
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
Forward Voltage-Max (VF) |
0.95 V
|
0.79 V
|
JESD-30 Code |
R-PDSO-F5
|
R-PDSO-F3
|
JESD-609 Code |
e3
|
|
Moisture Sensitivity Level |
1
|
|
Non-rep Pk Forward Current-Max |
150 A
|
150 A
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
5
|
3
|
Operating Temperature-Max |
175 °C
|
150 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Output Current-Max |
10 A
|
10 A
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
|
Rep Pk Reverse Voltage-Max |
100 V
|
100 V
|
Reverse Current-Max |
100 µA
|
150 µA
|
Surface Mount |
YES
|
YES
|
Technology |
SCHOTTKY
|
SCHOTTKY
|
Terminal Finish |
Matte Tin (Sn) - annealed
|
|
Terminal Form |
FLAT
|
FLAT
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Base Number Matches |
1
|
1
|
|
|
|
Compare MBR10100MFST3G with alternatives
Compare G10100F5 with alternatives