MBRD340-T3-LF
vs
SFAF802GHC0G
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
WON-TOP ELECTRONICS CO LTD
|
TAIWAN SEMICONDUCTOR CO LTD
|
| Package Description |
DPAK-3/2
|
R-PSFM-T2
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Additional Feature |
FREE WHEELING DIODE, LOW POWER LOSS
|
HIGH RELIABILITY
|
| Application |
EFFICIENCY
|
EFFICIENCY
|
| Case Connection |
CATHODE
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
0.5 V
|
0.95 V
|
| JEDEC-95 Code |
TO-252
|
TO-220AC
|
| JESD-30 Code |
R-PSSO-G2
|
R-PSFM-T2
|
| JESD-609 Code |
e3
|
e3
|
| Moisture Sensitivity Level |
1
|
|
| Non-rep Pk Forward Current-Max |
75 A
|
125 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Current-Max |
3 A
|
8 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
FLANGE MOUNT
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Rep Pk Reverse Voltage-Max |
40 V
|
100 V
|
| Reverse Current-Max |
200 µA
|
10 µA
|
| Surface Mount |
YES
|
NO
|
| Technology |
SCHOTTKY
|
|
| Terminal Finish |
Matte Tin (Sn)
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Position |
SINGLE
|
SINGLE
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Base Number Matches |
1
|
1
|
| Reference Standard |
|
AEC-Q101; UL RECOGNIZED
|
| Reverse Recovery Time-Max |
|
0.035 µs
|
|
|
|
Compare MBRD340-T3-LF with alternatives
Compare SFAF802GHC0G with alternatives