MBRD360RLG
vs
MBRD360TR
feature comparison
| Pbfree Code |
Yes
|
|
| Part Life Cycle Code |
End Of Life
|
Active
|
| Ihs Manufacturer |
ONSEMI
|
SANGDEST MICROELECTRONICS (NANJING) CO LTD
|
| Part Package Code |
DPAK (SINGLE GAUGE) TO-252
|
|
| Package Description |
DPAK-3
|
DPAK-3/2
|
| Pin Count |
3
|
|
| Manufacturer Package Code |
369C
|
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Factory Lead Time |
58 Weeks, 4 Days
|
|
| Samacsys Manufacturer |
onsemi
|
|
| Additional Feature |
FREE WHEELING DIODE
|
FREE WHEELING DIODE
|
| Application |
POWER
|
GENERAL PURPOSE
|
| Case Connection |
CATHODE
|
CATHODE
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
0.45 V
|
0.7 V
|
| JESD-30 Code |
R-PSSO-G2
|
R-PSSO-G2
|
| JESD-609 Code |
e3
|
|
| Moisture Sensitivity Level |
1
|
|
| Non-rep Pk Forward Current-Max |
75 A
|
75 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
175 °C
|
150 °C
|
| Operating Temperature-Min |
-65 °C
|
-55 °C
|
| Output Current-Max |
3 A
|
3 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
|
| Rep Pk Reverse Voltage-Max |
60 V
|
60 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
SCHOTTKY
|
SCHOTTKY
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Position |
SINGLE
|
SINGLE
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Base Number Matches |
1
|
2
|
| Reverse Current-Max |
|
200 µA
|
| Reverse Test Voltage |
|
60 V
|
|
|
|
Compare MBRD360RLG with alternatives
Compare MBRD360TR with alternatives