MBRM130LT3
vs
STPS1L30M
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
ON SEMICONDUCTOR
|
STMICROELECTRONICS
|
| Part Package Code |
DO-216AA
|
DO-216AA
|
| Package Description |
PLASTIC, CASE 457-04, POWERMITE-2
|
ST MITE PACKAGE-2
|
| Pin Count |
2
|
2
|
| Manufacturer Package Code |
CASE 457-04
|
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Samacsys Manufacturer |
onsemi
|
STMicroelectronics
|
| Application |
GENERAL PURPOSE
|
GENERAL PURPOSE
|
| Case Connection |
CATHODE
|
CATHODE
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
0.52 V
|
0.34 V
|
| JEDEC-95 Code |
DO-216AA
|
DO-216AA
|
| JESD-30 Code |
S-PSSO-G1
|
S-PSSO-G1
|
| JESD-609 Code |
e0
|
e3
|
| Non-rep Pk Forward Current-Max |
50 A
|
50 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
1
|
1
|
| Operating Temperature-Max |
125 °C
|
150 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Output Current-Max |
1 A
|
1 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
235
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reference Standard |
UL RECOGNIZED
|
|
| Rep Pk Reverse Voltage-Max |
30 V
|
30 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
SCHOTTKY
|
SCHOTTKY
|
| Terminal Finish |
Tin/Lead (Sn80Pb20)
|
Matte Tin (Sn) - annealed
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Position |
SINGLE
|
SINGLE
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Base Number Matches |
2
|
2
|
| Factory Lead Time |
|
15 Weeks
|
| Moisture Sensitivity Level |
|
1
|
|
|
|
Compare MBRM130LT3 with alternatives
Compare STPS1L30M with alternatives